Advanced packaging for photonics, optics and electronics for low cost manufacturing in Europe
Project closed
The APPLAUSE project ran for three and a half years and came to a close at the end of October 2022. It was followed by the standard final reporting period and by the final review meeting, held in January 2023.
This website is maintained as an archive of the project. Presentations, news items and papers published by the consortium after the project period are recorded in the News and Results sections.
About APPLAUSE
The drive for new technology in advanced packaging for photonics, optics and electronics created an opportunity to build the competitive edge of component and systems development in Europe, and to re-establish the European manufacturing and packaging value chain. The ECSEL JU project APPLAUSE (No. 826588) supported this by building on European expertise across a consortium of large companies, small and medium-sized enterprises, and research and technology organisations.
Dissemination
The consortium organised a dissemination day at the ESREF conference on Wednesday 28 September 2022, together with a summer school aimed at PhD students and junior engineers working in the field. The summer school offered participants the opportunity to learn from senior colleagues, covering the fundamentals, the state of the art and the outlook for advanced packaging, and to meet peers from across Europe.
This project has received funding from the ECSEL Joint Undertaking (JU) under grant agreement No 826588. The JU receives support from the European Union’s Horizon 2020 research and innovation programme and Belgium, Germany, Netherlands, Finland, Austria, France, Hungary, Latvia, Norway, Switzerland, Israel.