The APPLAUSE project, funded by the ECSEL Joint Undertaking under grant agreement No 826588, addresses advanced packaging for photonics, optics and electronics with the objective of enabling low cost manufacturing in Europe.
Packaging and assembly represent a substantial share of the cost of photonic and optoelectronic components. By developing manufacturing technologies that bring these steps into high-volume, automated production, the project aims to strengthen the competitive position of European component and systems development and to re-establish the European manufacturing and packaging value chain.
The consortium brings together large companies, small and medium-sized enterprises, and research and technology organisations from across Europe, each contributing a distinct role along that value chain. Work is organised around a set of industrial use cases spanning optical device packaging, wafer-level bonding and assembly processes.
Further information on the consortium is available on the Partners page.
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