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  • Welcome to visit our virtual booth at EFECS 2020November 23, 2020 - 1:02 pm

    Come and join us virtually at the APPLAUSE Booth at EFECS 2020 this week 25th and 26th November. Learn more about the project by visiting our booth where you can check the latest information and contact us directly using the chat function. Welcome! More information on the event can be found at: https://efecs.vfairs.com/ 

  • EPS European flagship event – ESTC 2020 (15-18 September) – Register now for this fully virtual, live and interactive conference!August 21, 2020 - 7:59 am

    The 8th Electronics System-Integration Technology Conference (ESTC) running this year 15th-18th September will be a fully virtual live event which will allow for real-time interactions. The conference programme includes five keynote presentations, a live workshop on Heterogeneous Integration Roadmap (HIR), three more plenary Special Sessions, and a virtual exhibition. The extensive programme consists of 90 […]

  • Besi Austria GmbH presented recent work on ultra-high accuracy chip-to-wafer bonding at ECTC June 2020July 28, 2020 - 9:13 am

    The Electronic Components and Technology Conference (ECTC) is the premier international event that brings together the best in packaging, components and microelectronic system science, technology and education. Last month, the ECTC 2020, sponsored by the IEEE Electronics Packaging Society, was held for the first time in a virtual format. Birgit Brandstätter from APPLAUSE Partner Besi […]

  • Progress updates given in Month 12 online meetingApril 30, 2020 - 6:30 am

    The APPLAUSE Project held a successful online Month 12 Consortium Meeting in the last week of April. Unable to meet in person due to the current coronavirus situation, we had a great level of attendance on the teleconference – all Partner organisations represented and up to 55 people on the call. Status updates were given […]

  • APPLAUSE Partner Aalto University, speaks at TMS2020March 31, 2020 - 6:58 am

    Last month, prior to the major travel restrictions, Vesa Vuorinen from APPLAUSE Partner Aalto University, presented at The Minerals, Metals & Materials Society (TMS) in San Diego, California. The TMS Annual Meeting & Exhibition brings together more than 4,000 engineers, scientists, business leaders, and other professionals in the materials’ science field for a comprehensive, cross-disciplinary […]

This project has received funding from the ECSEL Joint Undertaking (JU) under grant agreement No 826588. The JU receives support from the European Union’s Horizon 2020 research and innovation programme and Belgium, Germany, Netherlands, Finland, Austria, France, Hungary, Latvia, Norway, Switzerland, Israel.

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