Published in TechRivx:
- Xing Dai et al.: Versatile externally modulated lasers technology for multiple telecommunication applications
Published on Besi.com:
- Birgit Brandstätter et al.: High-speed ultra-accurate direct C2W bonding
This project has received funding from the ECSEL Joint Undertaking (JU) under grant agreement No 826588. The JU receives support from the European Union’s Horizon 2020 research and innovation programme and Belgium, Germany, Netherlands, Finland, Austria, France, Hungary, Latvia, Norway, Switzerland, Israel.