Rolf Aschenbrenner, Deputy Director at IZM

Rolf Aschenbrenner received the B.S. degree in mechanical engineering from the University for Applied Science, Gießen, Germany, in 1986 and the M.S. degree in physics from the University of Gießen, Germany, in 1991. From 1991 to 1992 he has worked at the University of Gießen and in 1993, he joined the Research Center for Microperipheric Technologies at the Technical University of Berlin. Since March 1994 he has been employed at the Fraunhofer Institute for Reliability and Microintegration Berlin (IZM) where he is presently the Deputy Director and Head of the Department System Integration and lnterconnection Technologies.

He received the iNEMI International Recognition Award in 2005, the CPMT David Feldman Outstanding Contribution Award 2013 and the European Semi Award 2016.

As a member of the IEEE EPS Society Board of Governors Rolf Aschenbrenner has worked as a European representative on the Conference Advisory Board Committee, and has played an active role in the globalization of IEEE EPS in terms of membership and chapter development. He served as IEEE EPS Vice President, Technical and IEEE EPS Vice President, Conferences. From January 2010 until December 2011 he was IEEE EPS President and in 2012 he became IEEE Fellow.

The topic of Rolf’s talk will be The Heterogeneous Integration Roadmap (HIR) 

HIR is a roadmap to the future of electronics identifying technology requirements and potential solutions. The primary objective is to stimulate pre-competitive collaboration between industry, academia and government to accelerate progress. The roadmap offers professionals, industry, academia and research institutes a comprehensive, strategic forecast of technology over the next 15 years. The HIR also delivers a 25-year projection for heterogeneous integration of Emerging Research Devices and Emerging Research Materials with longer research-and-development timelines. The HIR is sponsored by three IEEE Societies (Electronics Packaging Society, Electron Devices Society and Photonics Society) together with SEMI and ASME Electronics & Photonics Packaging Division.

Dirk Meier, Dr. rer. nat., CTO  at Integrated Detector Electronics (IDEAS)

Dirk Meier is Chief Technology Officer at the Company IDEAS in Oslo. Previously, he was a Researcher at the company Gamma Medica in Oslo, at the University of Michigan and at CERN in Geneva. He graduated at the Max-Planck Institute for Nuclear Physics and the University of Heidelberg. He has been working on most of IDEAS’ products for radiation detection and imaging. Currently, he is leading the company’s technology development on infrared imaging.

Topic of Dirk’s talk:

Thermal Infrared Imaging wiht Microbolometer Arrays

Improvements in the radiometric performance of microbolometers will enable new application areas for thermal infrared imaging. IDEAS and partners are working on new microbolometer arrays with integrated circuit readout electronics that improve the array resolution and the microbolometer NETD and time constant. The lecture will introduce the nature of thermal infrared radiation and several applications of thermal imaging. The focus will be on the imaging technology developed by IDEAS and partners and the new applications that are enabled by their R&D.

Dr. Alina Schreivogel R&D Project Manager at Würth Elektronik GmbH & Co. KG Circuit Board Technology

Alina Schreivogel studied Chemistry at the University of Stuttgart and received the Diploma in 2004. In 2008 she was awarded Ph.D. from University of Stuttgart in the field of Organic Chemistry. After several years as Scientist and Academic Councillor she joined 2010 Würth Elektronik GmbH & Co KG, Circuit Board Division as a scientist and project manager in the Research and Development Department. Since 2020, she took the responsibility of Research Center focusing on Flex- and Stretch Foil Systems, Printing Technologies, Embedding Technologies in Foils, Medical and Textile Electronics.

The topic of Alina’s talk will be:

Stretchable PCB

A significant trend in electronics is their steadily increasing integration into our everyday lives. As a result, flexible and rigid-flexible circuits, for example, have become part of many everyday products. The demand for increasingly smaller circuit carriers that are also better adapted to the three-dimensional contours also remains high. The incessant striving of miniaturization and free deformability of electronic components is particularly important in the field of medical technology.

Würth Elektronik has been working on solutions to these issues for several years and, as part of the solution, it worked with the Fraunhofer Institute to develop stretchable circuit carriers. By using thermoplastic polyurethane as a new base material and designing conductor tracks in meander or snake shapes, for example, properties such as extreme flexibility and elasticity can be created. These characteristics open up entirely new possibilities for the integration of electronics in the fields of sensor technology, (soft) robotics and smart textiles. The soft and skin-friendly properties of polyurethanes also make them suitable for use in the medical sector.

Vesa Vuorinen Senior Lecturer at Aalto University

Dr. Vesa Vuorinen received his M.Sc. degree 1995 in Materials Science and Engineering and D.Sc. (Tech.) degree in 2006 in the Department of Electronics from the former Helsinki University of Technology. Currently he is working in Aalto University as senior university lecturer and project manager in the research group of Electronics Integration and Reliability.
During the last decade, his research has been focusing on materials compatibility in heterogeneous systems with the emphasis on interfacial phenomena. He has also been responsible for teaching physics of failure and reliability assessment in electronics and direct research cooperation with the industrial partners for the last twenty years. He has contributed to two text books dealing with interfacial compatibility issues and thermodynamics of solid state diffusion as well as authored or co-authored over 50 scientific papers and several book chapters.

Topic of Vesa’s talk on 29th September with Knut Eilif Aasmundtveit:

WLP Bonding

Many MEMS/MOEMS components require vacuum sealing for accurate operation. Solid-Liquid Interdiffusion (SLID) bonding is well suited, as the bondline consists of thin, well-defined layers of metallizations and intermetallics, surviving the high post-processing temperatures typically used for getter activation and subsequent packaging and assembly processes. SLID bonding is compatible with wafer-level processing, allowing efficient manufacturing and simultaneous formation of hermetic encapsulation and electrical interconnections. The talk will show our (USN’s and Aalto’s) contributions to the EU project “APPLAUSE”, as well as an overview of SLID material systems, properties, applications, and reliability.

Topic of Vesa’s talk on 30th September: Design for Reliability

The main objective is to discuss on the reliability challenges; Why failures occur, Where products fail and When failures occur? In addition, the failure mechanisms observed under a variety of stress states are rationalized from materials‘ compatibility viewpoint. In the DfR process flowchart the emphasis is also placed on understanding the acceleration factors in reliability testing practices from physics-of failure approach.

Dr.-Ing. Michael Schiffer, Head of Department WLSI at Fraunhofer IZ

Dr. Michael Schiffer is responsible for the wafer level packaging activities at the Fraunhofer IZM, Berlin. He received his Diploma in electrical engineering in 2003 and his PhD on a MEMS fuel mass flow controller in 2010, both from the Technical University of Berlin. In 2009, he joint TDK Sensors as a product development engineer for MEMS pressure sensors and was later heading the process engineering and operations department. He joined Fraunhofer IZM, Berlin in 2018 and is heading the department “Wafer Level System Integration” with approx. 45 full-time employees since 2019.

The topic of Michael’s talk will be:

3D Integration

3D system integration combines several components from different semi-conductor technologies in order to use their best properties. Components for analog and digital signal and data processing, communication or sensors are integrated into (extremely) small but powerful systems. Aiming leading-edge products, this technology approach has numerous challenges: Different technologies, node sizes and materials have to be taken into account which usually has direct impact on wafer/device handling, electrical and mechanical interconnection, and protection from external influences which in addition might also have conflicting requirements. Driven to furthest extent, a co-design/technology topic most prominent in that field is the chiplet system design approach for building complex systems. The talk will present trends and challenges for 3D system integration.

Dr. Hélène Debrégeas Director of Innovation at Almae Technologies

Hélène Debrégeas received Engineering degree from Telecom ParisTech in 1994, Mathematics Agrégation teaching certificate in 1995, and Ph.D on widely tunable lasers in 2007. She has worked for more than 20 years at Alcatel Research center (now Nokia Bell Labs, within III-V Lab) on InP transmitters such as electro-absorption modulated lasers, widely tunable laser, and Silicon photonic integrated circuits. From 2012 to 2014, she worked at Nokia Bell Labs Murray Hill (NJ, USA) on hybrid integration of InP transmitters and silica passive waveguides. In 2018 she joined Almae Technologies, a spin-off from III-V Lab, focused on developing and producing InP transmitters for telecommunication applications. She is in charge of research and innovation, to develop next generation products and their hybridization with other technologies or packaging. She contributed to more than 50 peer-reviewed journal and conference papers, 20 patents, and a Springer book chapter on widely tunable lasers.

Topic of Hélène’s talk:

The development of a high-speed 400G/s transciever in the frame of European project APPLAUSE

– the application of 400Gb/s transcievers in datacom and the challenge of low-cost packaging

– the transmitter: 4 InP-based laser-modulators operating at 100Gb/s PAM4 uncooled

– the receivers: 4 photodiodes with backside lenses

– the subsystem geometry and assembly techniques (fine alignment or self-alignment)

– reliability of devices and the challenge of non hermetic packaging

Mr. David Schönebeck (M.Sc.), Process Specialist / Besi Austria

David Schönebeck has finished high school in 2008 and subsequently worked as a vehicle prototype test engineer in South Germany and the USA. After graduating in Advanced Materials Science at Ulm University in 2017, David joined Besi Austria GmbH as a Process Specialist. Besides his work in ECSEL projects, mainly APPLAUSE, he is Besi’s dedicated expert for flip chip processes.

The topic of David’s talk will be: DIE Bonding

Modern electronic devices are assemblies of dies on circuit boards, on other dies, or on wafers. The wide range of requirements regarding the interconnect technologies and placement accuracies between these dies and their submounts have brought up a variety of bonding technologies. The lecture gives insights on the challenges of the die handling and provides an overview on state-of-the-art die bonding technologies.

Dr. Ksenija Varga, Business Development Manager at EV Group

Ksenija Varga is business development manager at EV Group, where she focuses on market and business development of maskless lithography tools for advanced packaging (EVG’s LITHOSCALE®). Prior to EV Group, Ksenija worked at FujiFilm Electronic Materials with the Head Quarter in Belgium as a key account manager for Tier 1 semiconductor fabs in Europe. Ksenija hold a Ph.D. in natural sciences (Dr.rer.nat.) from Leopold-Franzens University Innsbruck in Austria. Before entering the semiconductor industry, Ksenija worked for several years as an R&D project leader in the chemical industry.

The topic of Kesenija’s talk will be:

Lithography for advanced packaging

The talk focuses on the maskless lithography technology (MLE) to address future back–end lithography needs for advanced packaging, MEMS, and IC substrates. The new industry vision requires new HVM tools that integrate new designs schemes as traditional back–end lithography is affected by several limitations restricting its applicability. The highly scalable “digital lithography” delivers the flexibility to enable short development cycles for next–generation devices. This innovative MLE technology bridges the gap between R&D and production while offering a scalable solution capable of dynamically addressing die and wafer–level designs simultaneously, and at the same time meet critical requirements for various markets/applications.

Niek van Haare Process Specialist  at Besi Netherlands

The topic of Niek’s talk will be:

WL Encapsulation via Transfer Molding
Advanced packaging develops towards wafer and panel level processing, a field where new encapsulation technology can play a contributing role. This lecture addresses the technology of film assisted wafer level transfer molding, focusing on the process itself, as well as the equipment behind it.

Knut Eilif Aasmundtveit / University of South-Eastern Norway (USN)

Knut E. Aasmundtveit received the M.Sc. degree in technical physics from the Norwegian Institute of Technology, Trondheim, Norway, in 1994, and the Ph.D. degree in materials physics from the Norwegian University of Science and Technology, Trondheim, in 1999. He was with Kongsberg Norspace, Horten, Norway, as RF System Design Engineer until 2004. He then joined the University of South-Eastern Norway (then: Vestfold University College) as Associate Professor, becoming Professor in 2013. He has authored or coauthored six book chapters and more than 100 journal and conference papers. His research interests include packaging and integration technology for micro- and nanosystems, such as intermetallic bonding, polymer-based bonding, nanomaterials integration in microsystems, as well as biomedical packaging. General Chair of ESTC 2020 (IEEE EPS), he presently serves as member of the ESTC Steering Committee.

The topic of Knut’s talk (with Vesa Vuorinen) will be:

WLP Bonding

Many MEMS/MOEMS components require vacuum sealing for accurate operation. Solid-Liquid Interdiffusion (SLID) bonding is well suited, as the bondline consists of thin, well-defined layers of metallizations and intermetallics, surviving the high post-processing temperatures typically used for getter activation and subsequent packaging and assembly processes. SLID bonding is compatible with wafer-level processing, allowing efficient manufacturing and simultaneous formation of hermetic encapsulation and electrical interconnections. The talk will show our (USN’s and Aalto’s) contributions to the EU project “APPLAUSE”, as well as an overview of SLID material systems, properties, applications, and reliability.

Mr. Ghanshyam Gadhiya, Scientific Researcher at Fraunhofer ENAS

Ghanshyam Gadhiya studied Micro and Nano Systems, with a specialization in Finite element analysis of power module from Technical university of Chemnitz in 2013. Since 2014, he is working as a scientific researcher at the Micro materials center, Fraunhofer ENAS. He has been working in European and Industrial projects with focus on parametric finite element modelling, thermo-mechanical simulation and optimization of microelectronics packages. His current research interests include system-in-package virtual prototyping, compact modelling and micro-electronics reliability study.

Topic of Ghanshyam’s talk:

Virtual Prototyping for SiP with Heterogeneous Integration

Heterogeneous Integration in System-in-Package (SiP) based on Fan-Out Wafer Level Technologies allows to meet various requirements such as improved performance, smaller form-factor, functional safety and low cost for upcoming new applications. Due to the thermo-mechanical stresses leading to device failure, the reliability risks must be assessed during the development of new products aiming for a design optimized for reliability. Virtual Prototyping (VP) based on Finite Element (FE) simulation allows the analysis of the thermomechanical situation during fabrication, tests and service within short time, allowing shorter development time. However, it requires parametric FE models, precise material and experimental data for validation. Because of this initial investment, it is advised to develop the VP schemes in a way that they are able to cover a wide variety of future products. The talk will present a modular system of parametric FE models that enables virtual reliability assessments of various SiP products based on Fan-Out Technologies.

David Gribenski Engineering Team Lead at KLA

David Gribenski holds a Master Degree in Engineering with specialization in metrology and material sciences from ESIL in Marseille. After his study, he started his career as R&D engineer in the field of solar cells. He then continued as Optical and Vision Applications engineer in Tomra, a food sorting company. He joined KLA in 2017 and is currently responsible as Engineering Team Lead for metrology equipment in the advanced packaging market, both wafer and substrate level manufacturing.

Topic of David’s talk:

Surface Profile Metrology for Lateral Scaling and Vertical Stacking

Since the 70’s, the semiconductor industry ability to follow Moore’s law has been the engine of a virtuous cycle: through transistor scaling, one obtains a better performance product, which induces an exponential growth of the semiconductor market.

The industry is now faced with the increasing importance of a new trend, “More than Moore” or the capability to interact with the outside world with functional diversification.

In this context, the backend/packaging industry is entering an inflection point with the development of SoC & SiP technologies, more commonly known as 3D stacking.

Prof. Dr.-Ing. Martin Schneider-Ramelow, Acting Director at Fraunhofer IZM

Professor Martin Schneider-Ramelow studied materials science at the Technical University of Berlin and received his doctorate in materials engineering in 1998. In August 1998, Martin Schneider-Ramelow joined Fraunhofer IZM in Berlin, initially as project and group leader (chip and wire technologies). From 2008 to 2018, he headed the System Integration and Interconnection Technologies (SIIT) department. Since 2014, he has been teaching as a guest lecturer at TU Berlin, where he was appointed full professor for “Materials for System Integration” in January 2017. In August 2020, Martin Schneider-Ramelow took over as acting director of the institute at Fraunhofer IZM. Martin Schneider-Ramelow is the author and co-author of more than 250 papers in his field and is considered a specialist in the quality and reliability of metallic connections and an internationally recognized expert in wire bonding technology. He is also a member of six national and international conference program committees in the field of electronic packaging, a Senior Member of the IEEE, a Fellow of IMAPS USA, and celebrated his tenth anniversary as Pre-siding Chairman of the International Microelectronics and Packaging Society (IMAPS) Germany in 2020.

The topic of Martin’s talk (with Olaf Wittler) will be:

Materials and Reliability

Within the trends of heterogeneous integration materials play a major role in enabling reliable systems. Therefore the understanding of their properties and the impact on reliability form the focus of this lecture. An overview will be given on major mechanisms relevant in heterogeneous integration supported by examples. Main mechanisms and properties regarding thermo-mechanical fatigue of solder and metal interconnects will be explained in detail. This kind of failure is strongly linked to the polymer materials used, which serve as encapsulation, adhesive or substrate. These materials are sensitive to moisture and temperature ageing. Moreover migration and corrosion issues can limit the lifetime and an introduction given.

Dr.-Ing. Olaf Wittler Team Leader at Fraunhofer IZM

Olaf Wittler studied physics in Paderborn, Berlin and London. He received his diploma degree in 1999 and the Ph.D. degree in 2004 from Technische Universität Berlin. His work experience involves different positions at Robert Bosch GmbH, TU Berlin and Fraunhofer IZM. He currently holds a position at Fraunhofer IZM as a team leader and chief scientist in the field of reliability simulation of packaging technologies and has authored and co-authored more than 100 conference and journal papers. His current research topics in involve: Warpage prediction in FO-WLP, FO-PLP and PCB-embedded packages; Reliability and ageing of RF-packages and materials; Advanced damage modelling in power electronics interconnection technologies; Reliability of substrates and via technologies.

The topic of Olaf’s talk (with Martin Schneider-Ramelow) will be:

Materials and Reliability

Within the trends of heterogeneous integration materials play a major role in enabling reliable systems. Therefore the understanding of their properties and the impact on reliability form the focus of this lecture. An overview will be given on major mechanisms relevant in heterogeneous integration supported by examples. Main mechanisms and properties regarding thermo-mechanical fatigue of solder and metal interconnects will be explained in detail. This kind of failure is strongly linked to the polymer materials used, which serve as encapsulation, adhesive or substrate. These materials are sensitive to moisture and temperature ageing. Moreover migration and corrosion issues can limit the lifetime and an introduction given.

Dr.-Ing. Dr.-Ing. habil. Ivan Ndip Team Leader at Fraunhofer IZM

The topic of Ivan’s talk will be:

RF Design for heterogenous integration

Many MEMS/MOEMS components require vacuum sealing for accurate operation. Solid-Liquid Interdiffusion (SLID) bonding is well suited, as the bondline consists of thin, well-defined layers of metallizations and intermetallics, surviving the high post-processing temperatures typically used for getter activation and subsequent packaging and assembly processes. SLID bonding is compatible with wafer-level processing, allowing efficient manufacturing and simultaneous formation of hermetic encapsulation and electrical interconnections. The talk will show our (USN’s and Aalto’s) contributions to the EU project “APPLAUSE”, as well as an overview of SLID material systems, properties, applications, and reliability

Dr. Eric Fribourg-Blanc Project Officer, KDT JU, European Commission

Eric Fribourg-Blanc holds a Master degree in Engineering with specialization in microtechnologies from Ecole Centrale de Lille. After an experience of scientific watch in Japan, he completed a PhD in electronics and materials with application to aeronautics from the University of Valenciennes. He has been working 11 years for CEA-LETI in France until 2014, during which he was also seconded 2 years to collaborate with the Vietnamese Institute for nanotechnology. Seconded to the European Commission in 2012, he has been involved in all major policies in relation with electronics, including the setup of ECSEL, IPCEI and the strategy on electronics. Since 2019 he is Programme Officer at ECSEL and currently KDT.

The topic of Eric’s talk will be:

EU chips act, collaborative projects

Key Digital Technologies (KDT) Joint Undertaking is a European partnership funding projects in the area of electronic components and systems. With a unique tripartite structure and co-funding from the European Commission and the participating states involved, it is the successor of ECSEL that was running under Horizon 2020.
The portfolio of the ECSEL projects will be presented to highlight the dynamics of the topics as well as the participants. The projects and topics of the 1st KDT call will be also presented. And the talk will end with highlighting the trends towards the Chips Joint Undertaking that will take over KDT in 2023.

 Bernard Grundlehner System Architect Connected Health Solutions at imec

Bernard Grundlehner received his M.S. degree from the University of Twente in 2002. He joined Holst Centre / IMEC-NL in 2007, where he worked on multiple topics related to biomedical signal analysis, including ECG analysis, emotion monitoring and bio-acoustics. From 2009 to 2015, he was responsible for the development of the Wearable EEG platform, algorithms for EEG signal improvement and clinical validation of the EEG prototypes. He is currently responsible for the Health Patch program execution and active as a system architect. He has (co-) authored over 35 peer-reviewed conference papers and journal publications in the field of biomedical signal processing and acquisition, and an Elsevier book chapter on ambulatory EEG monitoring.

The topic of Bernards’ talk with Tuomas Valtonen (University of Turku) & Volker Steier (Osypka) will be:

Examples for future medical devices from three different point of views

In the joint presentation, the experts will focus on the improvements of the Cardiac sensor done during the APPLAUSE project. We will further talk about the challenges of modern implants and describe where we see the rising opportunities in the medical sector.

Tuomas Valtonen Research Manager, Health Technology at University of Turku

The topic of Tuomas’ talk with Bernard Grundlehner (imec)  & Volker Steier (Osypka) will be:

Examples for future medical devices from three different point of views

In the joint presentation, the experts will focus on the improvements of the Cardiac sensor done during the APPLAUSE project. We will further talk about the challenges of modern implants and describe where we see the rising opportunities in the medical sector.