Continuing with the core topics of the ESREF 2022, the 33rd European Symposium on Reliability of Electron Devices, Failure Physics and Analysis, there will be several high-level themes for the two days of lectures. The themes include: real-world Application of the technology (photonics etc), Advanced packaging technologies, Processes for advanced packaging, as well as several keynote presentations. The intention of the APPLAUSE Summer School is to create a forum with a diverse gathering of industry and research professionals, junior technology enthusiasts and engineers, and students, representing the future workforce for these technologies.
Each day is divided into 2 or 3 main themes, each with approximately three lectures which go into detail. Lecture sessions will be approximately 45 minutes in duration. There will be coffee breaks and lunch break each day. On the Friday there will be the opportunity to visit the Fraunhofer showroom.
Berlin, Germany. Two days Thursday 29th September to Friday 30th September 2022.
Day 1: 29th September onsite at ESREF / Address: At H4 Hotel, Berlin
Day 2: 30th September Fraunhofer IZM / Address to be confirmed
There is an opportunity to join the ESREF event in the days before (Monday 26th– Wednesday 28th September). ESREF international symposium continues to focus on the newest developments and future prospects for quality and reliability management of materials, devices, and circuits for micro-, nano-, and optoelectronics. It provides a European forum for all aspects of reliability management and innovative analytical techniques for present and future electronic applications. Read more about the Applause session at ESREF:
We expect that PHD Students and junior engineers will join us for the two-day event. The APPLAUSE community is made up of 30 partners from 10 countries – from large enterprises and SMEs to Research and Technology Organisations. The APPLAUSE Summer School brings together in one place, a wealth of industry and research experience and the next wave of talented students. It will be a great opportunity to learn from senior colleagues, to gain insight ranging from the basics, to current state of the art, and to the vision for the future. The event will provide a great opportunity to network with representatives from all over Europe.
Summer School: 300€
Applause ESREF session + Summer school: 850€
Registration to the summer school and/or Applause ESREF session:
Check out below the program and set of expert speakers for the summer school. Stay tuned to this website as more presentation abstracts, speaker bios and other information will be updated here continuously.
Note that some changes might still be made to the schedule.
| Time | Presentation title | Speaker(s) | Description of the presentation |
|---|---|---|---|
| 8:00 – 8:30 | HIR ROADMAP | Rolf Aschenbrenner / Fraunhofer IZM | |
| 8:30 – 9:00 | PHOTONICS | To be confirmed | |
| 9:00 – 9:30 | THERMAL INFRARED IMAGING WIHT MICROBOLOMETER ARRAYS | Dirk Meier / IDEAS | Improvements in the radiometric performance of microbolometers will enable new application areas for thermal infrared imaging. IDEAS and partners are working on new microbolometer arrays with integrated circuit readout electronics that improve the array resolution and the microbolometer NETD and time constant. The lecture will introduce the nature of thermal infrared radiation and several applications of thermal imaging. The focus will be on the imaging technology developed by IDEAS and partners and the new applications that are enabled by their R&D. |
| 9:30 – 10:00 | STRETCHABLE PCB | Dr. Alina Schreivogel / WE Online | |
| 10:00 – 10:15 | COFFEE BREAK | ||
| 10:15 – 11:45 | WLP BONDING | Dr. Vesa Vuorinen / Aalto University Knut Eilif Aasmundtveit / USN | Many MEMS/MOEMS components require vacuum sealing for accurate operation. Solid-Liquid Interdiffusion (SLID) bonding is well suited, as the bondline consists of thin, well-defined layers of metallizations and intermetallics, surviving the high post-processing temperatures typically used for getter activation and subsequent packaging and assembly processes. SLID bonding is compatible with wafer-level processing, allowing efficient manufacturing and simultaneous formation of hermetic encapsulation and electrical interconnections. The talk will show our (USN’s and Aalto’s) contributions to the EU project “APPLAUSE”, as well as an overview of SLID material systems, properties, applications, and reliability. |
| 11:45 – 12:30 | 3D INTEGRATION | Michael Schiffer / Fraunhofer IZM | |
| 12:30 – 13:15 | PRINCIPLE OF OPERATION OF THE LASER DFB + ELECTRO-ABSORPTION MODULATOR, APPLICATIONS, PERFORMANCE REQUIREMENTS | Dr. Hélène Debrégeas / Almae Technologies | The lecture will present high-speed InP laser-modulators: – General description of the device and operation: DFB laser + electro-absorption modulator – Applications and challenges (datacom, access, DWDM transmission) – Design rules and optimisations – Fabrication process (epitaxy of quantum wells, butt-joint, gratings, lithographies and etchings, metal depositions, thinning) – Backend (cleaving, coating, mounting) and test: static (LIV / spectrum / modulator extinction) and dynamic (electro-optical bandwidth, eye diagram NRZ and PAM4) – Reliability aspects: burn-in, long-term ageing, degradation processes – Packaging, hybridization with SiPho (HF connections, optical coupling, optical feedback). – New developments, perspectives |
| 13:15 – 14:00 | LUNCH | ||
| 14:00 – 14:45 | DIE-BONDING | David Schonebeck / Besi AT | |
| 14:45 – 15:30 | LITHOGRAPHY FOR ADVANCED PACKAGING | Dr. Ksenija Varga / EVG | The talk focuses on the maskless lithography technology (MLE) to address future back–end lithography needs for advanced packaging, MEMS, and IC substrates. The new industry vision requires new HVM tools that integrate new designs schemes as traditional back–end lithography is affected by several limitations restricting its applicability. The highly scalable “digital lithography” delivers the flexibility to enable short development cycles for next–generation devices. This innovative MLE technology bridges the gap between R&D and production while offering a scalable solution capable of dynamically addressing die and wafer–level designs simultaneously, and at the same time meet critical requirements for various markets/applications. |
| 15:30 – 16:15 | WL ENCAPSULATION VIA TRANSFER MOLDING | Niek van Haare / Besi Netherlands | Advanced packaging develops towards wafer and panel level processing, a field where new encapsulation technology can play a contributing role. This lecture addresses the technology of film assisted wafer level transfer molding, focusing on the process itself, as well as the equipment behind it. |
| Time | Presentation title | Speaker(s) | Description of the presentation |
|---|---|---|---|
| 8:30 – 9:15 | Design for reliability | Dr. Vesa Vuorinen / Aalto University | The main objective is to discuss on the reliability challenges; Why failures occur, Where products fail and When failures occur? In addition, the failure mechanisms observed under a variety of stress states are rationalized from materials‘ compatibility viewpoint. In the DfR process flowchart the emphasis is also placed on understanding the acceleration factors in reliability testing practices from physics-of failure approach. |
| 9:15 – 10:00 | Virtual Prototyping for SiP with Heterogeneous Integration | Ghanshyam Gadhiya / ENAS | Heterogeneous Integration in System-in-Package (SiP) based on Fan-Out Wafer Level Technologies allows to meet various requirements such as improved performance, smaller form-factor, functional safety and low cost for upcoming new applications. Due to the thermo-mechanical stresses leading to device failure, the reliability risks must be assessed during the development of new products aiming for a design optimized for reliability. Virtual Prototyping (VP) based on Finite Element (FE) simulation allows the analysis of the thermomechanical situation during fabrication, tests and service within short time, allowing shorter development time. However, it requires parametric FE models, precise material and experimental data for validation. Because of this initial investment, it is advised to develop the VP schemes in a way that they are able to cover a wide variety of future products. The talk will present a modular system of parametric FE models that enables virtual reliability assessments of various SiP products based on Fan-Out Technologies. |
| 10:00 – 10:45 | Hybrid Bonding: Process, Inspection, and Metrology Challenges | Maarten Liebens / KLA | The ability to directly stack die utilizing direct Cu-to-Cu connections rather than microbumps has revolutionized CMOS image-sensor (CIS) technology and promises to do the same in the integration and packaging of Memory and Logic Devices. This capability, when combined with new multi-die heterogeneous integration system architectures, has the potential to drive significant changes in advanced packaging. This workshop will explore the process, inspection, and metrology challenges that need to be solved in order to enable hybrid bonding in new product types. |
| 10:45 – 11:15 | Coffee break | ||
| 11:15 – 12:00 | Materials & reliability | Martin Schneider-Ramelow & Olaf Wittler / Fraunhofer IZM | |
| 12:00 – 12:45 | RF Design for heterogenous integration | Ivan Ndip | Many MEMS/MOEMS components require vacuum sealing for accurate operation. Solid-Liquid Interdiffusion (SLID) bonding is well suited, as the bondline consists of thin, well-defined layers of metallizations and intermetallics, surviving the high post-processing temperatures typically used for getter activation and subsequent packaging and assembly processes. SLID bonding is compatible with wafer-level processing, allowing efficient manufacturing and simultaneous formation of hermetic encapsulation and electrical interconnections. The talk will show our (USN’s and Aalto’s) contributions to the EU project “APPLAUSE”, as well as an overview of SLID material systems, properties, applications, and reliability. |
| 12:45 – 14:15 | Lunch + showroom | ||
| 14:15 – 15:00 | EU chips act, collaborative projects | Eric Fribourg-Blanc / KDT | Key Digital Technologies (KDT) Joint Undertaking is a European partnership funding projects in the area of electronic components and systems. With a unique tripartite structure and co-funding from the European Commission and the participating states involved, it is the successor of ECSEL that was running under Horizon 2020. The portfolio of the ECSEL projects will be presented to highlight the dynamics of the topics as well as the participants. The projects and topics of the 1st KDT call will be also presented. And the talk will end with highlighting the trends towards the Chips Joint Undertaking that will take over KDT in 2023. |
| 15:00 – 15.45 | Examples for future medical devices from three different point of views | Bernard Grundlehner & Tuomas Valtonen & Volker Steier / Osypka | In the joint presentation, OSYPKA will focus on the improvements of the Cardiac sensor done during the APPLAUSE project. We will further talk about the challenges of modern implants and describe where we see the rising opportunities in the medical sector. |
Dirk Meier is Chief Technology Officer at the Company IDEAS in Oslo. Previously, he was a Researcher at the company Gamma Medica in Oslo, at the University of Michigan and at CERN in Geneva. He graduated at the Max-Planck Institute for Nuclear Physics and the University of Heidelberg. He has been working on most of IDEAS’ products for radiation detection and imaging. Currently, he is leading the company’s technology development on infrared imaging.
Knut E. Aasmundtveit received the M.Sc. degree in technical physics from the Norwegian Institute of Technology, Trondheim, Norway, in 1994, and the Ph.D. degree in materials physics from the Norwegian University of Science and Technology, Trondheim, in 1999. He was with Kongsberg Norspace, Horten, Norway, as RF System Design Engineer until 2004. He then joined the University of South-Eastern Norway (then: Vestfold University College) as Associate Professor, becoming Professor in 2013. He has authored or coauthored six book chapters and more than 100 journal and conference papers. His research interests include packaging and integration technology for micro- and nanosystems, such as intermetallic bonding, polymer-based bonding, nanomaterials integration in microsystems, as well as biomedical packaging. General Chair of ESTC 2020 (IEEE EPS), he presently serves as member of the ESTC Steering Committee.
Dr. Vesa Vuorinen received his M.Sc. degree 1995 in Materials Science and Engineering and D.Sc. (Tech.) degree in 2006 in the Department of Electronics from the former Helsinki University of Technology. Currently he is working in Aalto University as senior university lecturer and project manager in the research group of Electronics Integration and Reliability.
During the last decade, his research has been focusing on materials compatibility in heterogeneous systems with the emphasis on interfacial phenomena. He has also been responsible for teaching physics of failure and reliability assessment in electronics and direct research cooperation with the industrial partners for the last twenty years. He has contributed to two text books dealing with interfacial compatibility issues and thermodynamics of solid state diffusion as well as authored or co-authored over 50 scientific papers and several book chapters.
David Schönebeck has finished high school in 2008 and subsequently worked as a vehicle prototype test engineer in South Germany and the USA. After graduating in Advanced Materials Science at Ulm University in 2017, David joined Besi Austria GmbH as a Process Specialist. Besides his work in ECSEL projects, mainly APPLAUSE, he is Besi’s dedicated expert for flip chip processes.
Ksenija Varga is business development manager at EV Group, where she focuses on market and business development of maskless lithography tools for advanced packaging (EVG’s LITHOSCALE®). Prior to EV Group, Ksenija worked at FujiFilm Electronic Materials with the Head Quarter in Belgium as a key account manager for Tier 1 semiconductor fabs in Europe. Ksenija hold a Ph.D. in natural sciences (Dr.rer.nat.) from Leopold-Franzens University Innsbruck in Austria. Before entering the semiconductor industry, Ksenija worked for several years as an R&D project leader in the chemical industry.
Ghanshyam Gadhiya studied Micro and Nano Systems, with a specialization in Finite element analysis of power module from Technical university of Chemnitz in 2013. Since 2014, he is working as a scientific researcher at the Micro materials center, Fraunhofer ENAS. He has been working in European and Industrial projects with focus on parametric finite element modelling, thermo-mechanical simulation and optimization of microelectronics packages. His current research interests include system-in-package virtual prototyping, compact modelling and micro-electronics reliability study.
Alina Schreivogel studied Chemistry at the University of Stuttgart and received the Diploma in 2004. In 2008 she was awarded Ph.D. from University of Stuttgart in the field of Organic Chemistry. After several years as Scientist and Academic Councillor she joined 2010 Würth Elektronik GmbH & Co KG, Circuit Board Division as a scientist and project manager in the Research and Development Department. Since 2020, she took the responsibility of Research Center focusing on Flex- and Stretch Foil Systems, Printing Technologies, Embedding Technologies in Foils, Medical and Textile Electronics.
Eric Fribourg-Blanc holds a Master degree in Engineering with specialization in microtechnologies from Ecole Centrale de Lille. After an experience of scientific watch in Japan, he completed a PhD in electronics and materials with application to aeronautics from the University of Valenciennes. He has been working 11 years for CEA-LETI in France until 2014, during which he was also seconded 2 years to collaborate with the Vietnamese Institute for nanotechnology. Seconded to the European Commission in 2012, he has been involved in all major policies in relation with electronics, including the setup of ECSEL, IPCEI and the strategy on electronics. Since 2019 he is Programme Officer at ECSEL and currently KDT.
Maarten Liebens received his M.S. (2006) in electro-mechanical engineering from the Catholic University of Leuven. He is currently working at KLA as product marketing manager for metrology equipment in the advanced packaging market, both wafer and substrate level manufacturing. Prior to KLA, he worked at imec and held several positions as integration engineer in the 3D program, defectivity & metrology engineer, and lithography process development engineer. After his studies he started at ASML as a development engineer for stage positioning measurement systems of the advanced lithography scanners and worked afterwards at KLA-Tencor as applications engineer for automated defect inspection systems for LED, MEMS and packaging applications.
Hélène Debrégeas received Engineering degree from Telecom ParisTech in 1994, Mathematics Agrégation teaching certificate in 1995, and Ph.D on widely tunable lasers in 2007. She has worked for more than 20 years at Alcatel Research center (now Nokia Bell Labs, within III-V Lab) on InP transmitters such as electro-absorption modulated lasers, widely tunable laser, and Silicon photonic integrated circuits. From 2012 to 2014, she worked at Nokia Bell Labs Murray Hill (NJ, USA) on hybrid integration of InP transmitters and silica passive waveguides. In 2018 she joined Almae Technologies, a spin-off from III-V Lab, focused on developing and producing InP transmitters for telecommunication applications. She is in charge of research and innovation, to develop next generation products and their hybridization with other technologies or packaging. She contributed to more than 50 peer-reviewed journal and conference papers, 20 patents, and a Springer book chapter on widely tunable lasers.
Jonas Tyssø holds a master’s degree in engineering cybernetics and has several years of engineering and R&D experience. As Chief Operating Officer in Cardiaccs AS, he has been heading the Cardiac sensor development project for 7 years. The current version is currently under clinical investigation, and Cardiaccs will present the opportunities for improvement offered by the results from the APPLAUSE project.
