Publications, conference contributions and presentations arising from the APPLAUSE project.
Selected publications
- Nikhilendu Tiwary, Vesa Vuorinen, Glenn Ross, Mervi Paulasto-Kröckel – Finite Element Simulation of Solid–Liquid Interdiffusion Bonding Process: Understanding Process-Dependent Thermomechanical Stress
- Obert Golim et al. – Low-temperature Metal Bonding for Optical Device Packaging
- Hexin Xia et al. – Impact of Micromachining Process on Cu–Sn Solid-Liquid Interdiffusion (SLID) Bonds
Video presentations on our research
The consortium produced a series of six short video presentations covering the research carried out across the project use cases, from bonding and interconnect processes to optical device packaging and assembly.
Dissemination
Project results were presented at the dissemination day held at the ESREF conference in September 2022, and at the accompanying summer school.