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ESREF international symposium continues to focus on the newest developments and future prospects for quality and reliability management of materials, devices, and circuits for micro-, nano-, and optoelectronics. It provides a European forum for all aspects of reliability management and innovative analytical techniques for present and future electronic applications.
As a part of the conference, Applause is having a dissemination day on Wednesday 28th of September to share some of the main themes and results from the project.
Check out the program below and stay tuned to this page for updates on the presentations and speakers!
Continuing with the same core topics, Applause is also organizing a summer school for PhD students and junior engineers on September 29th and 30th. Read more about the summer school through the link below.
When/Where:
Berlin, Germany, Wednesday 28th September
Onsite at ESREF / Address: At H4 Hotel, Berlin
There is opportunity to join the ESREF event in the days before (Monday 26th– Tuesday 28th September).
| Time | Session title | Description | Speaker |
|---|---|---|---|
| 9.00 – 10.40 | SESSION 1 | Session Chair: Moritz Stoerring | |
| Introduction to Applause | Introduction to Applause project and the dissemination event at ESREF. | Moritz Stoerring / imec Belgium | |
| Highly accurate C2W Bonding Equipment and Optical Transceiver Assembly | Yasser Makki / Besi Austria | ||
| Improved heart monitoring device for Cardiac Surgery Patients | In the joint presentation, OSYPKA will focus on the improvements of the Cardiac sensor done during the APPLAUSE project. We will further talk about the challenges of modern implants and describe where we see the rising opportunities in the medical sector. | Jonas Tysso / Cardiaccs Volker Steier / OSYPKA | |
| 10.40 – 11.20 | Coffee break | ||
| 11.20 – 13.00 | SESSION 2 | ||
| Hermetic wafer level bonding for MEMS/MOEMS applications | Session Chair: Helene Debregeas
Knut Eilif Aasmundtveit / University of South-Eastern Norway (USN) | ||
| 13.00 – 14.00 | Lunch break | ||
| 14.00 – 15.40 | SESSION 3 | ||
| High-speed datacom 400Gb/s transceiver with reduced manufacturing cost | The presentation will show the development of a high-speed 400G/s transciever in the frame of European project APPLAUSE: The application of 400Gb/s transcievers in datacom and the challenge of low-cost packaging; the transmitter: 4 InP-based laser-modulators operating at 100Gb/s PAM4 uncooled; the recievers: 4 avalanche photodiodes with backside lenses; the subsystem geometry and assembly techniques (fine alignment or self-alignment); reliability of devices and the challenge of non hermetic packaging | Session Chair: Knut Eilif Aasmundtveit
Helene Debregeas / Almae Technologies | |
| The design of a flexible, stretchable multimodal wearable vital sign patch for clinical use | As part of the execution of the APPLAUSE project, a vital sign patch was developed to serve multiple medical use cases. The foreseen uniqueness of the patch in terms of wear comfort, wear time and the number of parameters measured has lead to a challenging set of requirements. To meet these requirements, novel integration technologies were used, such as a densely integrated central mixed signal chip, thin film flex integration and the use of flexible, stretchable PCB technology. Guided by the strong experience of each contributing partner, an iterative design, simulation and test approach was used, of which the results will be presented. | Bernard Grundlehner / Imec the Netherlands | |
| 15.40 – 16.00 | Coffee | ||
| 16.00 – 18.00 | Poster session |
Speaker introductions
Mr. David Schönebeck (M.Sc.), Process Specialist / Besi Austria
David Schönebeck has finished high school in 2008 and subsequently worked as a vehicle prototype test engineer in South Germany and the USA. After graduating in Advanced Materials Science at Ulm University in 2017, David joined Besi Austria GmbH as a Process Specialist. Besides his work in ECSEL projects, mainly APPLAUSE, he is Besi’s dedicated expert for flip chip processes.
Vesa Vuorinen / Aalto University
Dr. Vesa Vuorinen received his M.Sc. degree 1995 in Materials Science and Engineering and D.Sc. (Tech.) degree in 2006 in the Department of Electronics from the former Helsinki University of Technology. Currently he is working in Aalto University as senior university lecturer and project manager in the research group of Electronics Integration and Reliability.
During the last decade, his research has been focusing on materials compatibility in heterogeneous systems with the emphasis on interfacial phenomena. He has also been responsible for teaching physics of failure and reliability assessment in electronics and direct research cooperation with the industrial partners for the last twenty years. He has contributed to two text books dealing with interfacial compatibility issues and thermodynamics of solid state diffusion as well as authored or co-authored over 50 scientific papers and several book chapters.
Knut Eilif Aasmundtveit / University of South-Eastern Norway (USN)
Knut E. Aasmundtveit received the M.Sc. degree in technical physics from the Norwegian Institute of Technology, Trondheim, Norway, in 1994, and the Ph.D. degree in materials physics from the Norwegian University of Science and Technology, Trondheim, in 1999. He was with Kongsberg Norspace, Horten, Norway, as RF System Design Engineer until 2004. He then joined the University of South-Eastern Norway (then: Vestfold University College) as Associate Professor, becoming Professor in 2013. He has authored or coauthored six book chapters and more than 100 journal and conference papers. His research interests include packaging and integration technology for micro- and nanosystems, such as intermetallic bonding, polymer-based bonding, nanomaterials integration in microsystems, as well as biomedical packaging. General Chair of ESTC 2020 (IEEE EPS), he presently serves as member of the ESTC Steering Committee.
Rony Jose James / CSEM
Rony Jose James, MSc. is Project Manager at CSEM SA, Switzerland. He is working at CSEM since 2007, focusing on integration of microsystems. He received his Master’s degree in Micro and Nano-Technology from Helsinki University of Technology in 2006. He has more than 16 years of experience in development of microsystem packaging technologies, focusing on topics like hermetic sealing and feedthrough technologies for micro-implantable devices, fine pitch bonding technologies, reliability analysis, photonic packaging and hybrid integration. He is the current chairman of the IEEE Electronic packaging Society, Swiss chapter.
Bernard Grundlehner / Imec the Netherlands
Bernard Grundlehner received his M.S. degree from the University of Twente in 2002. He joined Holst Centre / IMEC-NL in 2007, where he worked on several topics related to biomedical signal analysis, including ECG analysis, emotion monitoring and bio-acoustics. From 2009 to 2015, he was responsible for the development of the Wearable EEG platform, algorithms for EEG signal improvement and clinical validation of the EEG prototypes. He is currently responsible for the Health Patch program execution and active as a system architect. He has (co-) authored over 35 papers and conference proceedings in the field of biomedical signal processing and acquisition.
Dr. Hélène Debrégeas, director of innovation at Almae Technologies
Hélène Debrégeas received Engineering degree from Telecom ParisTech in 1994, Mathematics Agrégation teaching certificate in 1995, and Ph.D on widely tunable lasers in 2007. She has worked for more than 20 years at Alcatel Research center (now Nokia Bell Labs, within III-V Lab) on InP transmitters such as electro-absorption modulated lasers, widely tunable laser, and Silicon photonic integrated circuits. From 2012 to 2014, she worked at Nokia Bell Labs Murray Hill (NJ, USA) on hybrid integration of InP transmitters and silica passive waveguides. In 2018 she joined Almae Technologies, a spin-off from III-V Lab, focused on developing and producing InP transmitters for telecommunication applications. She is in charge of research and innovation, to develop next generation products and their hybridization with other technologies or packaging. She contributed to more than 50 peer-reviewed journal and conference papers, 20 patents, and a Springer book chapter on widely tunable lasers.
Tobias Wernicke received his Master’s degree in Material Science and Nanotechnology at the Friedrich-Alexander University of Erlangen. He focussed his studies in the fields of Materials for Electronics and Metallography. After joining EVG in 2016 as Process Technology Engineer, he focussed on the development of permanent bonding processes, such as for metal and anodic bonding applications. In 2018 he took over the position as Head of the Process Technology – Metal Bonding group at EVG.
