The APPLAUSE consortium organised a dissemination day at the ESREF conference on Wednesday 28 September 2022.
ESREF, the European Symposium on Reliability of Electron Devices, Failure Physics and Analysis, is the annual European forum for reliability and failure analysis of electronic devices and systems. The APPLAUSE dissemination day presented results developed across the project use cases to an audience of researchers and industry engineers working on packaging reliability.
The event was held alongside the project summer school, which addressed the same core topics for PhD students and junior engineers.
Presentations and publications arising from the project are collected on the Results page.