Time flies. Almost a month ago in Berlin, APPLAUSE held a one-day dissemination session within the ESREF 2022 conference – the 33rd European Symposium on Reliability of Electron Devices, Failure Physics and Analysis.
The session presented results developed across the project use cases to an audience of researchers and industry engineers working on packaging and reliability.
Alongside it, the consortium ran a summer school for PhD students and junior engineers, covering the same core topics from the fundamentals through to the state of the art. Further detail on both events is available on the ESREF and summer school pages.
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