Work Package Lead, Dr. Charles-Alix Manier presented a webinar on 1st December 2022 which included reference to the work developed in Use Case 3. Watch the full presentation here:
Specific reference to the APPLAUSE work is from 13 minutes onwards. Thanks to Dr. Manier for this presentation and to the teams involved for the work!
Fraunhofer hold regular webinar sessions, more information here:
Time flies! Almost one month ago in Berlin, APPLAUSE held a one-day dissemination session within the ESREF 2022 conference (33rd European Symposium on Reliability of Electron Devices Failure Physics and Analysis, September 26-29, 2022). More information about ESREF here: ESREF 2022 | 33rd European Symposium on Reliability of Electron Devices Failure Physics and Analysis
Three sessions were created with six main presentations given by consortium members focused on the results from the project. We had a good-sized audience from the conference attendees, many of whom heard about APPLAUSE for the first time. The day ended with the symposium poster session in which APPLAUSE had nine posters and a large screen showing the infra-red camera capabilities. More than one hundred attendees circulated, discussing the latest technological developments.
This was followed by a two-day ‘summer school’ with nineteen high-quality lectures for more than twenty students and young engineers. More information on the program here: Summer school – APPLAUSE (applause-ecsel.eu). The project gives thanks to all those who helped arrange the event, who presented and to the active attendees – all of whom created this great educational event!
Helene Debregeas from Almae Technologies was invited to give a workshop at ECIO (European Conference on Integrated Optics), which was held on May 4th to 6th 2022, in Milan, Italy. The topic of the workshop was “Towards passive hybridization of high-power and high-speed InP transmitters”.
Last month, the APPLAUSE related article, “Demonstrating 170 °C Low-Temperature Cu–In–Sn Wafer-Level Solid Liquid Interdiffusion Bonding” was featured in the IEEE Transactions on Components, Packaging and Manufacturing Technology popular articles list. Direct link to open access here: Demonstrating 170 °C Low-Temperature Cu–In–Sn Wafer-Level Solid Liquid Interdiffusion Bonding | IEEE Journals & Magazine | IEEE Xplore – Congrats Vesa Vuorinen et al.
The next published APPLAUSE related article “Finite Element Simulation of Solid–Liquid Interdiffusion Bonding Process: Understanding Process-Dependent Thermomechanical Stress” can now be found in the most popular IEEE Transactions on Components, Packaging and Manufacturing Technology reading list (May 2022). Congrats!
Members from the APPLAUSE Project Consortium will be attending the online EFECS 2021 event this week Tuesday 23rd to Thursday 25th November.
Search for our APPLAUSE ‘booth’ and come and have a chat! Colleagues from KLA ICOS (Belgium) Besi (Austria + Netherlands), IDEAS (Norway), EDI (Latvia), ams Osram (Austria), Nuromedia (Germany) and more will be at the event as well, so don’t hesitate to search for us on the networking tool of the event.
SEMICON Europa is back as in-person event in 2021! This year SEMICON Europa will be co-located with productronica in Munich, Germany, creating the strongest single event for electronics manufacturing in Europe, and broadening the range of attendees across the electronics chain.
The following Applause project partners are warmly welcoming visitors at their booths!
Come and join us virtually at the APPLAUSE Booth at EFECS 2020 this week 25th and 26th November. Learn more about the project by visiting our booth where you can check the latest information and contact us directly using the chat function. Welcome! More information on the event can be found at: https://efecs.vfairs.com/
The 8th Electronics System-Integration Technology Conference (ESTC) running this year 15th-18th September will be a fully virtual live event which will allow for real-time interactions. The conference programme includes five keynote presentations, a live workshop on Heterogeneous Integration Roadmap (HIR), three more plenary Special Sessions, and a virtual exhibition. The extensive programme consists of 90 oral presentations and more than 30 poster presentations. The keynote and special sessions will be recorded so nothing will be missed!
Register now, for this exciting virtual, live conference! ESTC is the European flagship conference of EPS, this year hosted by APPLAUSE Project Partner University of South-Eastern Norway, located in Vestfold, the “Electronic Coast” of Norway.
Registration link to ESTC 2020: https://www.estc-conference.net/estc-2020/registration-1
Note, the price will increase by €40 Euros after 24th August.
USN, in addition to taking on the local organiser role, are active APPLAUSE Project Partners and will give two APPLAUSE related poster presentations:
“A Simulation of Optical Scattering of IR-light Through a Micromachined Silicon Lid”, presented by Phillip Papatzacos, USN
“Evaluation on Silicon Diaphragms for Hermetic Packaging of Microbolometer Arrays”, presented by Hexin Xia, USN
APPLAUSE Project is further represented by Vesa Vuorinen, Aalto University, Finland who will give the oral presentation:
“Study of Cu-Sn-In System for Low Temperature, Wafer Level Solid Liquid Inter-Diffusion Bonding”
Don’t miss out on this expert forum! Further information for the conference programme can be found here: https://www.estc-conference.net/estc-2020/conference-schedule.
The Electronic Components and Technology Conference (ECTC) is the premier international event that brings together the best in packaging, components and microelectronic system science, technology and education. Last month, the ECTC 2020, sponsored by the IEEE Electronics Packaging Society, was held for the first time in a virtual format.
Birgit Brandstätter from APPLAUSE Partner Besi Austria GmbH presented their recent work on ultra-high accuracy chip-to-wafer bonding in a video presentation. Besi Austria GmbH acknowledged the APPLAUSE project and EU and Austrian funding support.
Visit Besi’s website for further details of the publication and to download a PDF version: https://www.besi.com/scientific-publications/. More information about the conference can be found at their ECTC webpages (http://ectc.net/).
The APPLAUSE Project held a successful online Month 12 Consortium Meeting in the last week of April. Unable to meet in person due to the current coronavirus situation, we had a great level of attendance on the teleconference – all Partner organisations represented and up to 55 people on the call. Status updates were given by the Workpackage and Use Case leads. The project progresses well! Thanks to all the contributing Partners! Watch this space for new updates and results as they come out of the project.
