Category: Uncategorized
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Latest article published by APPLAUSE Partners Aalto University and EVG
The APPLAUSE project, which officially ended last year, continues to deliver impact with the latest article published in Microelectronic Engineering, volume 286. Low-Temperature Wafer-Level Bonding with Cu-Sn-In Solid Liquid Interdiffusion for Microsystem Packaging, by partners Aalto University and EV Group, is available as an Open Access article. It continues the line of work on low-temperature…
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APPLAUSE Partner Fraunhofer IZM
One year after the official end of the project, two newsworthy pieces from APPLAUSE partner Fraunhofer IZM. The first is a blog post and interview, Efficiency meets affordability: A robust wafer-level packaging process for low-cost infrared cameras, with Charles-Alix Manier, covering developments made within the project use cases. Both illustrate the point made at the…
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Successful project final review meeting held
The final review meeting for the APPLAUSE project has been held, closing out the formal reporting period that followed the end of the work programme in October 2022. The review covered the technical outcomes of the use cases, the exploitation and dissemination activities carried out over the course of the project, and the impact of…
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APPLAUSE project partners are gearing up for the final review
With the work programme completed at the end of October 2022, the consortium is now preparing for the final review of the project. Partners are consolidating the technical outcomes of each use case, finalising the reporting for the project period, and assembling the material that will be presented to the reviewers. The results produced over…
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APPLAUSE partner Fraunhofer IZM held informative webinar on passive alignment, including developments from Use Case 3
Work package lead Dr Charles-Alix Manier of APPLAUSE partner Fraunhofer IZM presented a webinar on 1 December 2022 on passive alignment, including reference to the work developed in Use Case 3. Passive alignment is one of the key enablers the project has been pursuing: by fixing the optical alignment through the mechanical design of the…
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APPLAUSE project successful dissemination day and summer school
Time flies. Almost a month ago in Berlin, APPLAUSE held a one-day dissemination session within the ESREF 2022 conference – the 33rd European Symposium on Reliability of Electron Devices, Failure Physics and Analysis. The session presented results developed across the project use cases to an audience of researchers and industry engineers working on packaging and…
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Towards passive hybridization of high-power and high-speed InP transmitters – workshop at ECIO
Hélène Debrégeas of APPLAUSE partner Almae Technologies was invited to give a workshop at ECIO, the European Conference on Integrated Optics. The workshop addressed passive hybridization of high-power and high-speed InP transmitters. Passive alignment approaches of this kind remove the need for active, per-device optical alignment during assembly, and are one of the routes the…