Last month, prior to the major travel restrictions, Vesa Vuorinen from APPLAUSE Partner Aalto University, presented at The Minerals, Metals & Materials Society (TMS) in San Diego, California. The TMS Annual Meeting & Exhibition brings together more than 4,000 engineers, scientists, business leaders, and other professionals in the materials’ science field for a comprehensive, cross-disciplinary exchange of technical knowledge. Vesa and colleagues presented their recent work on Wafer Level SLID Bonding and acknowledged the APPLAUSE project and EU funding support.
Vesa explained: “These large events offer excellent visibility for our novel research to an international audience and provide a nice platform for good discussions on future topics ”
The TMS 2020 Event page can be found here and the technical program in detail found here.
