One year after the official end of the project, two newsworthy pieces from APPLAUSE partner Fraunhofer IZM.
The first is a blog post and interview, Efficiency meets affordability: A robust wafer-level packaging process for low-cost infrared cameras, with Charles-Alix Manier, covering developments made within the project use cases.
Both illustrate the point made at the close of the project: the technical work continues to find application well beyond the funded period.
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