One year after the official project end, two news worthy pieces from APPLAUSE Partner Fraunhofer IZM 

The first is a blog post/interview “Efficiency meets affordability: A robust wafer-level packaging process for low-cost infrared cameras” with Charles-Alix Mannier regarding developments made in Use Case 2: The interview includes a short video of Charles-Alix explaining some of the key innovations made during the project.

The second is a paper and publication “Wafer Level Capping Technology for Vacuum Packaging of Microbolometers,” given at the 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC): (subscription needed).

Congrats to Fraunhofer and APPLAUSE partners for continuing the great work!

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