One year after the official project end, two news worthy pieces from APPLAUSE Partner Fraunhofer IZM
The first is a blog post/interview “Efficiency meets affordability: A robust wafer-level packaging process for low-cost infrared cameras” with Charles-Alix Mannier regarding developments made in Use Case 2: https://lnkd.in/e7SD-6rh. The interview includes a short video of Charles-Alix explaining some of the key innovations made during the project.
The second is a paper and publication “Wafer Level Capping Technology for Vacuum Packaging of Microbolometers,” given at the 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC): https://lnkd.in/dKnkrh2w (subscription needed).
Congrats to Fraunhofer and APPLAUSE partners for continuing the great work!