The Electronic Components and Technology Conference (ECTC) is the premier international event bringing together packaging, components and microelectronic system science, technology and education.
At ECTC 2020, held in June, Besi Austria GmbH presented recent work on ultra-high-accuracy chip-to-wafer bonding carried out in the context of the project. Placement accuracy at this level is one of the conditions for moving photonic and optoelectronic assembly out of manual alignment and into high-volume automated production, which is a central objective of APPLAUSE.
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