Tag: advancedpackaging
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Latest article published by APPLAUSE Partners Aalto University and EVG
The APPLAUSE project, which officially ended last year, continues to deliver impact with the latest article published in Microelectronic Engineering, volume 286. Low-Temperature Wafer-Level Bonding with Cu-Sn-In Solid Liquid Interdiffusion for Microsystem Packaging, by partners Aalto University and EV Group, is available as an Open Access article. It continues the line of work on low-temperature…
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APPLAUSE Partner Fraunhofer IZM
One year after the official end of the project, two newsworthy pieces from APPLAUSE partner Fraunhofer IZM. The first is a blog post and interview, Efficiency meets affordability: A robust wafer-level packaging process for low-cost infrared cameras, with Charles-Alix Manier, covering developments made within the project use cases. Both illustrate the point made at the…
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APPLAUSE partner Fraunhofer IZM held informative webinar on passive alignment, including developments from Use Case 3
Work package lead Dr Charles-Alix Manier of APPLAUSE partner Fraunhofer IZM presented a webinar on 1 December 2022 on passive alignment, including reference to the work developed in Use Case 3. Passive alignment is one of the key enablers the project has been pursuing: by fixing the optical alignment through the mechanical design of the…
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APPLAUSE results create more impact
An article arising from the APPLAUSE project, Demonstrating 170 °C Low-Temperature Cu–In–Sn Wafer-Level Solid Liquid Interdiffusion Bonding, was featured last month in IEEE Transactions on Components, Packaging and Manufacturing Technology. Lowering the bonding temperature is one of the levers the project has been working on throughout its use cases: it widens the range of materials…
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EPS European flagship event ESTC 2020 15-18 September – register now for this fully virtual, live and interactive conference
The 8th Electronics System-Integration Technology Conference (ESTC) runs from 15 to 18 September 2020. This year the event is fully virtual and live, allowing real-time interaction between participants. The conference programme includes five keynote presentations alongside the technical sessions. ESTC is the European flagship event of the IEEE Electronics Packaging Society and covers the system-integration…
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Besi Austria GmbH presented recent work on ultra high accuracy chip to wafer bonding at ECTC June 2020
The Electronic Components and Technology Conference (ECTC) is the premier international event bringing together packaging, components and microelectronic system science, technology and education. At ECTC 2020, held in June, Besi Austria GmbH presented recent work on ultra-high-accuracy chip-to-wafer bonding carried out in the context of the project. Placement accuracy at this level is one of…
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APPLAUSE – an ECSEL Joint Undertaking project – focuses on developing advanced packaging for photonics, optics and electronics for low cost manufacturing
The APPLAUSE project, funded by the ECSEL Joint Undertaking under grant agreement No 826588, addresses advanced packaging for photonics, optics and electronics with the objective of enabling low cost manufacturing in Europe. Packaging and assembly represent a substantial share of the cost of photonic and optoelectronic components. By developing manufacturing technologies that bring these steps…