The 8th Electronics System-Integration Technology Conference (ESTC) running this year 15th-18th September will be a fully virtual live event which will allow for real-time interactions. The conference programme includes five keynote presentations, a live workshop on Heterogeneous Integration Roadmap (HIR), three more plenary Special Sessions, and a virtual exhibition. The extensive programme consists of 90 oral presentations and more than 30 poster presentations. The keynote and special sessions will be recorded so nothing will be missed!
Register now, for this exciting virtual, live conference! ESTC is the European flagship conference of EPS, this year hosted by APPLAUSE Project Partner University of South-Eastern Norway, located in Vestfold, the “Electronic Coast” of Norway.
Registration link to ESTC 2020: https://www.estc-conference.net/estc-2020/registration-1
Note, the price will increase by €40 Euros after 24th August.
USN, in addition to taking on the local organiser role, are active APPLAUSE Project Partners and will give two APPLAUSE related poster presentations:
“A Simulation of Optical Scattering of IR-light Through a Micromachined Silicon Lid”, presented by Phillip Papatzacos, USN
“Evaluation on Silicon Diaphragms for Hermetic Packaging of Microbolometer Arrays”, presented by Hexin Xia, USN
APPLAUSE Project is further represented by Vesa Vuorinen, Aalto University, Finland who will give the oral presentation:
“Study of Cu-Sn-In System for Low Temperature, Wafer Level Solid Liquid Inter-Diffusion Bonding”
Don’t miss out on this expert forum! Further information for the conference programme can be found here: https://www.estc-conference.net/estc-2020/conference-schedule.
