Last month, the APPLAUSE related article, “Demonstrating 170 °C Low-Temperature Cu–In–Sn Wafer-Level Solid Liquid Interdiffusion Bonding” was featured in the IEEE Transactions on Components, Packaging and Manufacturing Technology popular articles list. Direct link to open access here: Demonstrating 170 °C Low-Temperature Cu–In–Sn Wafer-Level Solid Liquid Interdiffusion Bonding | IEEE Journals & Magazine | IEEE Xplore – Congrats Vesa Vuorinen et al.

The next published APPLAUSE related article “Finite Element Simulation of Solid–Liquid Interdiffusion Bonding Process: Understanding Process-Dependent Thermomechanical Stress” can now be found in the most popular IEEE Transactions on Components, Packaging and Manufacturing Technology reading list (May 2022). Congrats!

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