An article arising from the APPLAUSE project, Demonstrating 170 °C Low-Temperature Cu–In–Sn Wafer-Level Solid Liquid Interdiffusion Bonding, was featured last month in IEEE Transactions on Components, Packaging and Manufacturing Technology.
Lowering the bonding temperature is one of the levers the project has been working on throughout its use cases: it widens the range of materials and components that can survive the assembly step, which in turn opens up packaging approaches that would otherwise be out of reach for optical and optoelectronic devices.
Further publications from the consortium are listed on the Results page.
Leave a Reply