The APPLAUSE project, which officially ended last year, continues to deliver impact with the latest article published in Microelectronic Engineering, volume 286.
Low-Temperature Wafer-Level Bonding with Cu-Sn-In Solid Liquid Interdiffusion for Microsystem Packaging, by partners Aalto University and EV Group, is available as an Open Access article.
It continues the line of work on low-temperature solid-liquid interdiffusion bonding that ran through the project, and which is collected on the Results page.
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