Author: Emile
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APPLAUSE results create more impact
An article arising from the APPLAUSE project, Demonstrating 170 °C Low-Temperature Cu–In–Sn Wafer-Level Solid Liquid Interdiffusion Bonding, was featured last month in IEEE Transactions on Components, Packaging and Manufacturing Technology. Lowering the bonding temperature is one of the levers the project has been working on throughout its use cases: it widens the range of materials…
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Come to meet us at EFECS!
Members of the APPLAUSE project consortium will be attending the online EFECS 2021 event this week, from Tuesday 23 to Thursday 25 November. Search for the APPLAUSE booth and come and have a chat. Colleagues from across the consortium will be available to discuss the project and its results.
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Come to meet our partners at SEMICON
SEMICON Europa returns as an in-person event in 2021. This year it is co-located with productronica in Munich, Germany, forming the strongest single event for electronics manufacturing in Europe. Several APPLAUSE partners are exhibiting. The event is an opportunity to discuss the equipment, materials and process developments coming out of the project directly with the…
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Welcome to visit our virtual booth at EFECS 2020
The APPLAUSE consortium is present at EFECS 2020 on 25 and 26 November with a virtual booth. Visitors to the booth can find the latest information on the project and contact the team directly through the chat function. EFECS, the European Forum for Electronic Components and Systems, is the annual meeting point for the European…
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EPS European flagship event ESTC 2020 15-18 September – register now for this fully virtual, live and interactive conference
The 8th Electronics System-Integration Technology Conference (ESTC) runs from 15 to 18 September 2020. This year the event is fully virtual and live, allowing real-time interaction between participants. The conference programme includes five keynote presentations alongside the technical sessions. ESTC is the European flagship event of the IEEE Electronics Packaging Society and covers the system-integration…
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Besi Austria GmbH presented recent work on ultra high accuracy chip to wafer bonding at ECTC June 2020
The Electronic Components and Technology Conference (ECTC) is the premier international event bringing together packaging, components and microelectronic system science, technology and education. At ECTC 2020, held in June, Besi Austria GmbH presented recent work on ultra-high-accuracy chip-to-wafer bonding carried out in the context of the project. Placement accuracy at this level is one of…
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Progress updates given in Month 12 online meeting
The APPLAUSE project held its Month 12 consortium meeting online during the last week of April 2020. With an in-person meeting ruled out by the coronavirus situation, the consortium moved the session to teleconference. Attendance held up well, with every partner organisation represented. The meeting reviewed progress at the twelve-month mark across all work packages…