The Electronic Components and Technology Conference (ECTC) is the premier international event that brings together the best in packaging, components and microelectronic system science, technology and education. Last month, the ECTC 2020, sponsored by the IEEE Electronics Packaging Society, was held for the first time in a virtual format.
Birgit Brandstätter from APPLAUSE Partner Besi Austria GmbH presented their recent work on ultra-high accuracy chip-to-wafer bonding in a video presentation. Besi Austria GmbH acknowledged the APPLAUSE project and EU and Austrian funding support.
Visit Besi’s website for further details of the publication and to download a PDF version: https://www.besi.com/scientific-publications/. More information about the conference can be found at their ECTC webpages (http://ectc.net/).