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This project has received funding from the ECSEL Joint Undertaking (JU) under grant agreement No 826588. The JU receives support from the European Union’s Horizon 2020 research and innovation programme and Belgium, Germany, Netherlands, Finland, Austria, France, Hungary, Latvia, Norway, Switzerland, Israel.
APPLAUSE results create more impact
Last month, the APPLAUSE related article, “Demonstrating 170 °C Low-Temperature Cu–In–Sn Wafer-Level Solid Liquid Interdiffusion Bonding” was featured in the IEEE Transactions on Components, Packaging and Manufacturing Technology popular articles list. Direct link to open access here: Demonstrating 170 °C Low-Temperature Cu–In–Sn Wafer-Level Solid Liquid Interdiffusion Bonding | IEEE Journals & Magazine | IEEE Xplore – Congrats Vesa Vuorinen et al.
The next published APPLAUSE related article “Finite Element Simulation of Solid–Liquid Interdiffusion Bonding Process: Understanding Process-Dependent Thermomechanical Stress” can now be found in the most popular IEEE Transactions on Components, Packaging and Manufacturing Technology reading list (May 2022). Congrats!
Come to meet us at EFECS!
Members from the APPLAUSE Project Consortium will be attending the online EFECS 2021 event this week Tuesday 23rd to Thursday 25th November.
Search for our APPLAUSE ‘booth’ and come and have a chat! Colleagues from KLA ICOS (Belgium) Besi (Austria + Netherlands), IDEAS (Norway), EDI (Latvia), ams Osram (Austria), Nuromedia (Germany) and more will be at the event as well, so don’t hesitate to search for us on the networking tool of the event.
Come to meet our partners at SEMICON
SEMICON Europa is back as in-person event in 2021! This year SEMICON Europa will be co-located with productronica in Munich, Germany, creating the strongest single event for electronics manufacturing in Europe, and broadening the range of attendees across the electronics chain.
The following Applause project partners are warmly welcoming visitors at their booths!
Welcome to visit our virtual booth at EFECS 2020
Come and join us virtually at the APPLAUSE Booth at EFECS 2020 this week 25th and 26th November. Learn more about the project by visiting our booth where you can check the latest information and contact us directly using the chat function. Welcome! More information on the event can be found at: https://efecs.vfairs.com/
EPS European flagship event – ESTC 2020 (15-18 September) – Register now for this fully virtual, live and interactive conference!
The 8th Electronics System-Integration Technology Conference (ESTC) running this year 15th-18th September will be a fully virtual live event which will allow for real-time interactions. The conference programme includes five keynote presentations, a live workshop on Heterogeneous Integration Roadmap (HIR), three more plenary Special Sessions, and a virtual exhibition. The extensive programme consists of 90 oral presentations and more than 30 poster presentations. The keynote and special sessions will be recorded so nothing will be missed!
Register now, for this exciting virtual, live conference! ESTC is the European flagship conference of EPS, this year hosted by APPLAUSE Project Partner University of South-Eastern Norway, located in Vestfold, the “Electronic Coast” of Norway.
Registration link to ESTC 2020: https://www.estc-conference.net/estc-2020/registration-1
Note, the price will increase by €40 Euros after 24th August.
USN, in addition to taking on the local organiser role, are active APPLAUSE Project Partners and will give two APPLAUSE related poster presentations:
“A Simulation of Optical Scattering of IR-light Through a Micromachined Silicon Lid”, presented by Phillip Papatzacos, USN
“Evaluation on Silicon Diaphragms for Hermetic Packaging of Microbolometer Arrays”, presented by Hexin Xia, USN
APPLAUSE Project is further represented by Vesa Vuorinen, Aalto University, Finland who will give the oral presentation:
“Study of Cu-Sn-In System for Low Temperature, Wafer Level Solid Liquid Inter-Diffusion Bonding”
Don’t miss out on this expert forum! Further information for the conference programme can be found here: https://www.estc-conference.net/estc-2020/conference-schedule.
Besi Austria GmbH presented recent work on ultra-high accuracy chip-to-wafer bonding at ECTC June 2020
The Electronic Components and Technology Conference (ECTC) is the premier international event that brings together the best in packaging, components and microelectronic system science, technology and education. Last month, the ECTC 2020, sponsored by the IEEE Electronics Packaging Society, was held for the first time in a virtual format.
Birgit Brandstätter from APPLAUSE Partner Besi Austria GmbH presented their recent work on ultra-high accuracy chip-to-wafer bonding in a video presentation. Besi Austria GmbH acknowledged the APPLAUSE project and EU and Austrian funding support.
Visit Besi’s website for further details of the publication and to download a PDF version: https://www.besi.com/scientific-publications/. More information about the conference can be found at their ECTC webpages (http://ectc.net/).